Semiconductor Advanced Packaging
Performance, power efficiency, area, and cost are driving packaging innovations. Learn how workflows provide fast, precise, and accurate time-to-data.
Novel semiconductor device fabrication requires highly accurate imaging and failure analysis to produce improved and optimized fabrication workflows. This means advanced (scanning) transmission electron microscopy (TEM and STEM, or (S)TEM) tools have become a critical component in all leading-edge wafer-fabrication processes.
However, TEM imaging and analysis are highly dependent on the quality of the sample. As a result, sample preparation is a crucial task in fabrication facilities and failure analysis labs. The problem is that conventional methods for ultra-thin (S)TEM sample preparation are challenging and time-consuming, requiring hours, if not days of manual operation by experienced users. The wide range of materials now used in device manufacturing, coupled with the need for site-specific information, only further complicates this process.
Thermo Fisher Scientific offers rapid, accurate, and robust sample preparation tools for (S)TEM imaging on advanced semiconductor designs. Our entire suite of sample preparation instruments allows you to reach atomic scale data faster, easier, and with minimal cost-per-sample. Additionally, Thermo Scientific AutoTEM 5 Software supports fully automated in-situ TEM sample preparation using DualBeam systems. This gives users (of any experience level) the ability to obtain fast, reliable, and repeatable results. Click through to the appropriate product pages below for more information.
Performance, power efficiency, area, and cost are driving packaging innovations. Learn how workflows provide fast, precise, and accurate time-to-data.
Innovation starts with research and development. Learn more about solutions to help you understand innovative structures and materials at the atomic level.
Complex semiconductor device structures result in more places for defects to hide. Learn more about failure analysis solutions to isolate, analyze, and repair defects.
Many factors impact yield, performance, and reliability. Learn more about solutions to characterize physical, structural, and chemical properties.
Novel architectures and materials pose new challenges. Learn how to pinpoint faults and characterize materials, structures, and interfaces.
Display technologies are evolving to improve display quality and light conversion efficiency. Learn how metrology, failure analysis, and characterization solutions provide insights.
Manufacturing today’s complex semiconductors requires exact process controls. Learn more about advanced metrology and analysis solutions to accelerate yield learnings.
As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.
To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.