With more than four decades innovating failure analysis, metrology, and characterization solutions for the semiconductor industry, Thermo Fisher Scientific is one of the world’s premier providers of ultra-high-resolution tools for semiconductor imaging and analysis at the nanoscale.
Whether you’re researching new materials and structures, investigating electrical and physical failures, or measuring critical dimensions and features on logic, memory, power, and other semiconductor devices, stay informed on the most advanced solutions and technology updates by subscribing to our communications.
You’ll receive notifications of new:
- Whitepapers, application notes, educative blogs, eBooks, case studies, datasheets, and more
- Webinars and training covering a wide range of innovative techniques and applications
- Product demonstrations and presentations at industry events and conferences
- Products and upgrades
Semiconductor Packaging Challenges
In this SPARK on-demand webinar, you will discover:
- Failure analysis, process metrology, and characterization challenges impacting advanced packaging devices
- Industry-leading assembly failure isolation and analysis workflows, and complete die analysis workflows
SPARK 3D Reconstruction in Semiconductors
In this SPARK on-demand webinar, you will learn about:
- The value of 3D reconstruction
- How to perform 3D reconstruction
- How other semiconductor companies use 3D reconstruction
Process Metrology, Failure Analysis, and R&D Solutions for Information Display Technology
From VR headsets to television screens, displays play a vital role in your user experiences.
Watch our webinar to learn about:
- Information display technologies and their unique process metrology, FA, and R&D challenges
- Information about Thermo Fisher Scientific solutions to address process metrology, FA, and R&D challenges