Semiconductor research and development
Innovation starts with research and development. Learn more about solutions to help you understand innovative structures and materials at the atomic level.
With time-to-yield being critical to profitability, it is too costly for advanced foundries, integrated device manufacturers and fabless companies to wait until after dicing and packaging to identify the source of electrical faults. The Thermo Scientific Meridian WS-DP system enables faster defect localization by using production testers, load boards, and probe cards.
All diagnostic options from the Meridian product line are available for the Meridian WS-DP, including: LVx, emission, LADA, and OBIRCH.
Laser voltage imaging (LVI), shows the physical locations of transistors that are active at a specific frequency on the Meridian WS-DP system.
Continuous wave laser voltage probing (CW-LVP) acquires functional waveform data on the Meridian WS-DP system.
Photon emission microscopy (PEM) on the Meridian platform is based on an optimized combination of a high sensitivity InGaAs or DBX camera and high numerical aperture (NA) aberration-corrected optics. The Meridian WS-DP system provides high-resolution through-silicon imaging for backside device analysis. Low noise and high sensitivity enable emission data with unmatched signal-to-noise ratios, resulting in rapid, transistor-level fault detection. The DBX configuration provides industry-leading results even on sub-0.5 Vdd devices.
Mechanical | ATE compatibility | Commercially available ATE testers & customized solutions |
Probe Card / Load Board |
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Probe pin count | Probe arrays of <100 to >10,000 pins | |
Wafer Stage vacuum | 20lbs vacuum force for wafer stability | |
Motion Control | Die-to-die stepping | Supported and integrated into Sierra software |
Platen motion |
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Wafer / DUT supported |
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XYZ microscope stage accuracy | 1 um | |
XY wafer stage accuracy | 5um | |
Die size compatibility | A wide range of solutions |
Innovation starts with research and development. Learn more about solutions to help you understand innovative structures and materials at the atomic level.
Complex semiconductor device structures result in more places for defects to hide. Learn more about failure analysis solutions to isolate, analyze, and repair defects.
Optical Fault Isolation
Increasingly complex designs complicate fault and defect isolation in semiconductor manufacturing. Optical fault isolation techniques allow you to analyze the performance of electrically active devices to locate critical defects that cause device failure.
Optical Fault Isolation
Increasingly complex designs complicate fault and defect isolation in semiconductor manufacturing. Optical fault isolation techniques allow you to analyze the performance of electrically active devices to locate critical defects that cause device failure.
To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.