ESD Semiconductor Qualification
Every electrostatic discharge (ESD) control plan is required to identify devices that are sensitive to ESD. We offer a complete suite of test systems to help with your device qualification requirements.
The Thermo Scientific Celestron transmission line pulse/very fast transmission line pulse (TLP/VF-TLP) Test System can be configured for both Standard TLP and VF-TLP for testing at the wafer and/or package level. Optional probes can be used to measure signals on pins or pads other than the ones being stressed. The Celestron system software is the most comprehensive in the industry and utilizes graphics to assist in system setup and connection to the device under test (DUT). During test operations, it displays the recorded TLP pulse voltage and current waveforms, compiled pulsed I-V curve, leakage current measurements, and DC I-V curve trace data. The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.
Flexible test capabilities
The Thermo Scientific Celestron TLP/VF-TLP Test System can be configured for Standard TLP and VF-TLP for testing at the wafer level and/or package level. Optional probes can also be used to measure signals on pins or pads other than the ones being stressed.
Unsurpassed test control
The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.
Pulse generator
High current TLP pulse generator.
Probers
Can be interfaced with semiautomatic probers.
Style Sheet for Products Table Specifications
| Standard TLP configuration | Pulse widths from 30 to 500ns | Integrated in the pulser box, the standard TLP Pulse width is 100ns Additional pulse widths can be added externally through a cable change ranging from 30 to 500ns Optional computer controlled pulse width with 3 selectable pulse widths |
| Rise times available | Standard rise time is 200ps Optional rise times from 500ps to 10ns Controlled by optional external rise time filters 2ns and 10ns external rise time filter included Optional computer controlled rise time with 3 selectable rise times Note: 500 MHz or faster oscilloscope is required for TLP measurements 1 GHz or grater scope is recommended for measurements with rise times of less than 1ns | |
| Support of all TLP configurations | Optional changing of configuration for 25 to 500 ohm delivery impedances Support for all configurations described in the ESD Association’s TLP Standard Test Method Both wafer level and package testing at all impedances | |
| Standard TLP / VF-TLP configuration | Integrated system controller | No need for a dedicated computer Windows® operating system |
| Integrated source/meter unit | Curve Tracing to ± 200V Leakage measurements down to 50pA DUT failure detection based on leakage or voltage with forced current or both | |
| Transmission Line Pulse (TLP / VF-TLP) | Designed in compliance with the current ESD Association Standard Test Method Documents (ANSI/ESD STM 5.5.1-2016) | |
| Standard VF-TLP configuration | Pulse widths from 1.2 to 10ns | Selected by cable change at front of system Standard widths are 1.2, 2.5 and 5ns (others optional) |
| Rise times from 200ps to 2ns | Controlled by optional filters Standard rise times are 200 and 300ps 2ns external rise time fi ler included | |
| Maximum pulse current | 15A into a 50 ohm load Approximately 30A into a short circuit | |
| Maximum open circuit voltage | 1500V |
ESD Semiconductor Qualification
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ESD Compliance Testing
Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.
ESD Compliance Testing
Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.
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