Giheung electron microscopy center
11 Seocheon-Ro, 201 beon-Gil, Suite107
Giheung-gu, Youngin-si, Gyeonggi-do, 17111
South Korea
Phone: +82-1661-9003
Fax: +82-31-888-1830
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Available Techniques/Events/Available Instruments/Request training
Electron microscopy center in Giheung, South Korea
Our NanoPort Customer Innovation Center in South Korea is an electron microscopy (EM) center of excellence designed to provide you with the opportunity to explore our equipment & solutions while advancing your knowledge and skills. This immersive experience enables in-depth knowledge of Thermo Fisher Scientific solutions while connecting with product experts.
Giheung NanoPort customer innovation center
What can you expect at the NanoPort in Giheung, South Korea?
At the NanoPort Customer Innovation Center , you will have the ability to engage in expert-led workshops to get you familiar with electron microscopy, participate in instrument demos that can be used with your own samples, the ability to ask questions, and learn from our EM experts at the center and more.
Whether you are unfamiliar with the capabilities of electron microscopy (EM) or just looking to stay up to date with the latest advances and instrumentation, our Nanoport Experience will meet your needs and ensure you are comfortable with your new purchase.
Electron microscopy techniques
The Giheung Nanoport Customer Innovation Center has over 15 professionals with many years of hands-on experiences at customer sites and most of them hold a PhD or MSc in their area of expertise.
We invite you to bring your own sample to the NanoPort Customer Innovation Center to personally experience the difference our instrumentation, software, and knowledge can make for your challenging analysis and characterization needs.
See the Thermo Fisher Scientific difference – the expertise and analytical techniques available at the Giheung NanoPort CIC include:
For materials science
- Transmission electron microscopy (TEM)
- Scanning electron microscopy (SEM)
- DualBeam microscopy (combined focused ion beam and SEM (FIB-SEM) tools)
For semiconductors
- Transmission electron microscopy (TEM)
- Scanning electron microscopy (SEM)
- DualBeam microscopy (combined focused ion beam and SEM (FIB-SEM) tools)
- Physical failure analysis (PFA)
- Electrical failure analysis (EFA)
For life sciences
- Transmission electron microscopy (TEM)
- DualBeam microscopy (combined focused ion beam and SEM (FIB-SEM) tools)
- Cryo-electron tomography
- Scanning electron microscopy
- Volume electron microscopy
- Single particle analysis
- Rational drug design
Electron microscopy sciences Korea
See what scientists and researchers have accomplished with our instrumentation and software
Proposal of Tilt-axis Adjustment in V-NAND Plan-view without Si Substrate Using Automated Metrology of Transmission Electron Microscope, Dong-yeob Kim, Su-yeon Kim, Woo-jun Kwon, Min-kook Kim, Christopher H. Kang, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 279-281
The Influence of Temperature on Photoresist Profiles during TEM Sample Preparation using Cryo-FIB, Ji Hye Hyun, Youngjin Cho, Hyoungsic Cho, Seojin Kim, In Chang Choi, Beomjun Kim, Yoonhae Kim and Christopher H. Kang, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 233-237, November 12–16, 2023
Advanced Axis Correction for Automated Workflow of Vertical Scanning Electron Microscopy Applications, Jooeun Lee, Woo Jun Kwon, In Chang Choi, and Christopher H. Kang, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 228-232, November 12–16, 2023
Large Area Imaging for Metrology with High Accuracy Using Scanning Electron Microscope, Kyungbin Kim, Eugene Kim, Innyeong Choi, Woo Jun Kwon, and Christopher H. Kang, ISTFA 2023: Conference Proceedings from the 49th International Symposium for Testing and Failure Analysis, 224-227, November 12–16, 2023
Metrology analysis method of unique technique using low pixel resolution image for 3D NAND, Suyeon Kim, Dongyeob Kim, Woo Jun Kwon and Christopher H. Kang, IMC20, The 20th International Microscopy Congress, 10-15 Sep. 2023, Busan, Korea #1219
Denoising of backscattered electrons image via U-Net convolutional neural networks for high quality 3D tomography of Ni-based oxide cathode secondary particles, Hee-Beom Lee, Min-Hyoung Jung, Ki-Ju Choi, Ji-Young Park, Eun-Jin Kim, Sang-Jun Oh, Hyun-Bum Jeon, Woo-Sung Jang, Young-Min Kim, IMC20, The 20th International Microscopy Congress, 10-15 Sep. 2023, Busan, Korea #0303
PFIB Delayering– Nanoprobing Workflow on 5nm FinFET device, Ha Young Choi, Christopher H. Kang, William Lowe, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 269-276
Abbreviated tomography techniques for quick correction of slides in 3-Dimensional NAND flash architectures, Hee-Beom Lee, Masahiro Ishimaru, John McPhillips, Roger L. Alvis, Timothy A. Johnson, Christopher H. Kang, Inchang Choi, Youngjin Cho, 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Application of Large Area Imaging for Metrology with high throughput using SEM, Eugene Kim, Kyungbin Kim, Innyeong Choi, Woo Jun Kwon, and Christopher H. Kang, Korea Society of Microscopy, Nov. 2-4, 2022
Eco-friendly natural mineral biotite as a cesium adsorbent: Utilizing low-concentration acid and hydrogen peroxide, Sunki Kwon a,b,*, Donghoon Seoung c, Eunji Jung d, Jiyoung Park e, Jongmyoung Lim e, Byungkyu Park f, Youngjin Cho f, Pyosang Kim c, Hyeonsu Kim c, Yongmoon Lee g
New strategy to improve the accuracy of quantitative analysis of energy dispersive spectroscopy, Won-Jin Moon1, Seul Gi Yu1, Yang Soo Kim2, Byung-Kyu Park3, Wan-Gil Jung1,∗ and Ho-Jun Song4,∗
A New Delayering Application Workflow in Advanced 5nm Technology Device with Xenon Plasma Focus Ion Beam Microscopy, Ha Young Choi, Seo Jin Kim1 and Christopher H. Kang, Chun Cheng Tsao, ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis, p274
Automated Metrology on the verticality of Cross-sectioned channel hole at VNAND with over 200 layers by Transmission Electron microscope, Dong-yeob Kim, Jong-ick Son, Christopher H Kang, ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis, p313
Automated cell layer counting and marking at target layer of 3D NAND TEM samples by Focused Ion Beam, Jisu Ryu, Seojin Kim, Christopher H. Kang, ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis, p347
Automated sample depth targeting with low kV cleaning by Focused Ion Beam Microscopy for Atom Probe Tomography, Woo Jun Kwon, Jisu Ryu, and Christopher H. Kang, Michael B. Schmidt, and Nicholas Croy, ISTFA 2020: Proceedings from the 46th International Symposium for Testing and Failure Analysis, p299
Ga Aggregation in Cu Layer on In-Situ TEM Analysis: Observation and Alternative Solutions, Seo-Jin Kim, Byung-Kyu Park and Christopher H. Kang, ISTFA 2020: Proceedings from the 46th International Symposium for Testing and Failure Analysis, p325
Events at the NanoPort Customer Innovation Center in Giheung, Korea
Workshops: A combination of discussion and practical work focusing on a particular subject/industry, where we encourage attendees to share their knowledge and experience.
In-house courses: Hands-on in-person training that helps customers build their electron microscopy application skillset.
Remote training: Tailored training delivered remotely straight from our NanoPort’s top experts to you, whether you are in your lab or at any remote location.
Please contact us to learn more about the cost of these events and how to schedule them.
Electron microscopes and analytical instruments available at the Korean electron microscopy facility
DualBeam instruments
Thermo Scientific Helios 5 HX DualBeam Sample preparation for TEM and STEM imaging or atom probe tomography. Easy to use with advanced automation. Capable of high quality subsurface 3D characterization. For Semiconductors, Materials Science
Thermo Scientific Helios 5 Laser PFIB (Plasma FIB) System Combined plasma focused ion beam and laser ablation tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution. For Materials Science
Scanning electron microscopes
Thermo Scientific Verios 5 HP SEM Scanning electron microscopy characterization of nanomaterials with sub-nanometer resolution and high material contrast. For Semiconductors, Materials Science
Thermo Scientific Apreo 2 SEM Scanning electron microscope for versatile, high performance materials imaging and analysis. For Semiconductors, Materials Science, Life Sciences
Thermo Scientific Axia ChemiSEM SEM EDS instrument that is flexible, easy to use, and offers instantaneous, quantitative elemental analysis. For Materials Science
Digital lab
- Three high-end workstations
Sample preparation room
- Thin film coater
- Plasma cleaner
- Argon-beam sample-surface cleaner
- 3D printer
- Optical microscopes
Coming soon
Transmission electron microscopes
DualBeam instruments
Fleet management system
Electron microscope remote training
On-site training for new instrumentation can be time-consuming, and the training needs of each facility and lab can vary greatly. To address these difficulties, we have developed a new Remote Application Training program to bring our best application scientists and training material to you, no matter where you are in the world.
Request a demo or training
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